Product Overview
The Intel Xeon E3-1240L v3 CPU is a robust and efficient microprocessor designed specifically for server applications. Built on the advanced Haswell microarchitecture, this OEM/tray CPU delivers exceptional performance with a base frequency of 2.0 GHz, and can turbo boost up to 3.0 GHz for single-core tasks, or 2.8 GHz across all cores, allowing it to handle demanding workloads with ease.
This server-grade processor features 4 cores and 8 threads, providing a solid foundation for multitasking and resource-intensive applications. With a manufacturing process of just 0.022 microns, it is engineered for optimized power efficiency, boasting a Thermal Design Power (TDP) of only 25 watts, making it an ideal choice for environments where thermal and energy considerations are critical.
Equipped with a comprehensive cache structure, the E3-1240L v3 includes a 4 x 32 KB Level 1 cache, a 4 x 256 KB Level 2 cache, and a substantial 8 MB Level 3 cache, ensuring rapid data access times and enhanced system responsiveness. The integrated memory controller supports up to 32 GB of DDR3 memory across two channels, with memory speeds of up to 1600 MHz and excellent bandwidth capabilities.
The processor supports PCI Express 3.0, allowing for high-speed connectivity to various peripherals, and features Direct Media Interface 2.0 for efficient data transfer between the CPU and other components. As a uniprocessor system, the E3-1240L v3 is perfect for businesses seeking reliable performance in a compact form factor, without sacrificing power efficiency or processing capabilities. Whether for virtualization, database management, or cloud computing, this CPU stands out as a dependable choice for any server infrastructure.
This server-grade processor features 4 cores and 8 threads, providing a solid foundation for multitasking and resource-intensive applications. With a manufacturing process of just 0.022 microns, it is engineered for optimized power efficiency, boasting a Thermal Design Power (TDP) of only 25 watts, making it an ideal choice for environments where thermal and energy considerations are critical.
Equipped with a comprehensive cache structure, the E3-1240L v3 includes a 4 x 32 KB Level 1 cache, a 4 x 256 KB Level 2 cache, and a substantial 8 MB Level 3 cache, ensuring rapid data access times and enhanced system responsiveness. The integrated memory controller supports up to 32 GB of DDR3 memory across two channels, with memory speeds of up to 1600 MHz and excellent bandwidth capabilities.
The processor supports PCI Express 3.0, allowing for high-speed connectivity to various peripherals, and features Direct Media Interface 2.0 for efficient data transfer between the CPU and other components. As a uniprocessor system, the E3-1240L v3 is perfect for businesses seeking reliable performance in a compact form factor, without sacrificing power efficiency or processing capabilities. Whether for virtualization, database management, or cloud computing, this CPU stands out as a dependable choice for any server infrastructure.
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E3-1200 v3 |
| Model number | E3-1240L v3 |
| CPU part number | CM8064601575341 is an OEM/tray CPU |
| Frequency | 2000 MHz |
| Turbo frequency | 3000 MHz (1 core) |
| 2800 MHz (all cores) | |
| Bus speed | 5 GT/s DMI |
| Clock multiplier | 20 |
| Package | 1150-land Flip-Chip Land Grid Array |
| Socket | Socket 1150 / H3 / LGA1150 |
| Microarchitecture | Haswell |
| Platform | Denlow |
| Processor core | Haswell LGA1150 |
| Core stepping | C0 (QFFS, SR1T8) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 4 |
| The number of threads | 8 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 4 x 32 KB |
| Level 2 cache size | 4 x 256 KB |
| Level 3 cache size | 8 MB |
| Physical memory | 32 GB |
| Multiprocessing | Uniprocessor |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 2 | |
| Supported memory: DDR3-1333, DDR3-1600 | |
| DIMMs per channel: up to 2 | |
| Maximum memory bandwidth (GB/s): 25.6 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| PCI Express 3.0 interface | |
| Thermal Design Power | 25 Watt |
