Product Overview
The Intel Xeon E5-2660 v3 is a powerful server-grade CPU designed to meet the high demands of modern data centers and enterprise environments. Operating at a base frequency of 2.60 GHz and capable of turbo performance up to 3.30 GHz, this processor delivers exceptional speed and efficiency, making it ideal for resource-intensive applications.
Engineered with a robust Haswell microarchitecture, the E5-2660 v3 features 10 cores and 20 threads, enabling simultaneous multi-threading for optimal parallel processing capabilities. This CPU supports a maximum physical memory of 768 GB across two dedicated memory controllers, allowing that can efficiently handle substantial workloads without lag or bottlenecks.
With a high-speed 9.6 GT/s QPI and 5 GT/s DMI, data transfer rates are optimized, ensuring seamless communication between the CPU and other components. It also boasts an impressive 25 MB level 3 cache, enhancing data retrieval speeds and overall system responsiveness.
Designed for reliable and consistent performance, the E5-2660 v3 supports advanced ECC memory, which safeguards against data corruption for uninterrupted operations. Additionally, the processor is designed to operate within a thermal design power (TDP) of 105 Watts, efficiently balancing power consumption and performance with a maximum operating temperature of 79°C.
This OEM/tray CPU, specifically part number CM8064401446117, is sold without a heatsink and is compatible with Socket LGA2011-3 motherboards, making it an ideal choice for bespoke server builds or upgrades. The Intel Xeon E5-2660 v3 caters to enterprises looking to enhance their server capabilities, bringing unparalleled processing power and reliability to critical business applications.
Engineered with a robust Haswell microarchitecture, the E5-2660 v3 features 10 cores and 20 threads, enabling simultaneous multi-threading for optimal parallel processing capabilities. This CPU supports a maximum physical memory of 768 GB across two dedicated memory controllers, allowing that can efficiently handle substantial workloads without lag or bottlenecks.
With a high-speed 9.6 GT/s QPI and 5 GT/s DMI, data transfer rates are optimized, ensuring seamless communication between the CPU and other components. It also boasts an impressive 25 MB level 3 cache, enhancing data retrieval speeds and overall system responsiveness.
Designed for reliable and consistent performance, the E5-2660 v3 supports advanced ECC memory, which safeguards against data corruption for uninterrupted operations. Additionally, the processor is designed to operate within a thermal design power (TDP) of 105 Watts, efficiently balancing power consumption and performance with a maximum operating temperature of 79°C.
This OEM/tray CPU, specifically part number CM8064401446117, is sold without a heatsink and is compatible with Socket LGA2011-3 motherboards, making it an ideal choice for bespoke server builds or upgrades. The Intel Xeon E5-2660 v3 caters to enterprises looking to enhance their server capabilities, bringing unparalleled processing power and reliability to critical business applications.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-2600 v3 |
| Model number | E5-2660 v3 |
| CPU part numbers | CM8064401446117 is an OEM/tray CPU |
| BX80644E52660V3 is a boxed CPU | |
| Spec code | SR1XR |
| Frequency | 2600 MHz |
| Turbo frequency | 3300 MHz |
| Bus speed | 9.6 GT/s QPI (4800 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 26 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-3 / R3 / LGA2011-3 |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Grantley-EP |
| Processor core | Haswell-EP |
| Core stepping | M1 (SR1XR) |
| CPUID | 306F2 (SR1XR) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 10 |
| The number of threads | 20 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 10 x 32 KB |
| Level 2 cache size | 10 x 256 KB |
| Level 3 cache size | 25 MB |
| Physical memory | 768 GB |
| Multiprocessing | Up to 2 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 |
| Memory channels per controller: 2 | |
| Supported memory: DDR4-1600, DDR4-1866, DDR4-2133 | |
| DIMMs per channel: 3 | |
| Maximum memory bandwidth (GB/s): 68 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect v1.1 (2 links) | |
| PCI Express 3.0 interface (40 lanes) | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Maximum operating temperature | 79°C |
| Minimum power dissipation | 38 Watt (C1E state) |
| 13 Watt (C6 state) | |
| Thermal Design Power | 105 Watt |
