Product Overview
The Intel Xeon E5-1650 v2 is a powerhouse microprocessor designed specifically for server applications, bringing exceptional performance and efficiency to demanding business environments. With a clock frequency of 3.50 GHz and the ability to turbo boost up to 3.90 GHz, this OEM/tray CPU (part number CM8063501292204) delivers an impressive combination of speed and multitasking capabilities. Equipped with six cores and twelve threads, the E5-1650 v2 efficiently handles simultaneous processes, making it ideal for environments where multiple applications and tasks run in parallel.
Engineered with Ivy Bridge microarchitecture, this processor showcases advanced manufacturing technology at 0.022 micron, ensuring remarkable performance while optimizing energy consumption. The 2011-land Flip-Chip Land Grid Array (LGA2011) package offers robust compatibility and reliable installation in server setups. Supporting a range of DDR3 memory options—up to four channels with speeds from 800 MHz to 1866 MHz—the E5-1650 v2 can maximize throughput with a substantial memory bandwidth of 59.7 GB/s.
In addition to its high core count and efficient design, the Xeon E5-1650 v2 supports error-correcting code (ECC) memory, enhancing data integrity and reliability in critical workloads. The CPU features a thermal design power (TDP) of 130 watts, with a wide operating temperature range from 5°C to 70°C, making it suitable for various server environments.
With no integrated graphics, this CPU focuses exclusively on processing power, catering to server applications where graphically intensive tasks are not required. The Intel Xeon E5-1650 v2 stands as an essential component for businesses seeking reliable and robust server performance, ensuring smooth operations under pressure and scalability for future growth.
Engineered with Ivy Bridge microarchitecture, this processor showcases advanced manufacturing technology at 0.022 micron, ensuring remarkable performance while optimizing energy consumption. The 2011-land Flip-Chip Land Grid Array (LGA2011) package offers robust compatibility and reliable installation in server setups. Supporting a range of DDR3 memory options—up to four channels with speeds from 800 MHz to 1866 MHz—the E5-1650 v2 can maximize throughput with a substantial memory bandwidth of 59.7 GB/s.
In addition to its high core count and efficient design, the Xeon E5-1650 v2 supports error-correcting code (ECC) memory, enhancing data integrity and reliability in critical workloads. The CPU features a thermal design power (TDP) of 130 watts, with a wide operating temperature range from 5°C to 70°C, making it suitable for various server environments.
With no integrated graphics, this CPU focuses exclusively on processing power, catering to server applications where graphically intensive tasks are not required. The Intel Xeon E5-1650 v2 stands as an essential component for businesses seeking reliable and robust server performance, ensuring smooth operations under pressure and scalability for future growth.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-1600 v2 |
| Model number | E5-1650 v2 |
| CPU part number | CM8063501292204 is an OEM/tray CPU |
| Spec code | SR1AQ |
| Frequency | 3500 MHz |
| Turbo frequency | 3600 MHz (5 or 6 cores) |
| 3700 MHz (2, 3 or 4 cores) | |
| 3900 MHz (1 core) | |
| Bus speed | 5 GT/s DMI |
| Clock multiplier | 35 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011 / LGA2011 |
| Architecture / Microarchitecture | |
| Microarchitecture | Ivy Bridge |
| Processor core | Ivy Bridge-EP |
| Core stepping | S1 (QF7V, SR1AQ) |
| CPUID | 306E4 (SR1AQ) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 6 |
| The number of threads | 12 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 6 x 32 KB |
| Level 2 cache size | 6 x 256 KB |
| Level 3 cache size | 12 MB |
| Physical memory | 768 GB |
| Multiprocessing | Uniprocessor |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 4 | |
| Supported memory: DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600, DDR3-1866 | |
| Maximum memory bandwidth (GB/s): 59.7 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| PCI Express 3.0 interface | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Minimum/Maximum operating temperature | 5°C - 70°C |
| Thermal Design Power | 130 Watt |
