Product Overview
The Intel Xeon E7-8867 v3 is a powerhouse designed for demanding server environments, delivering unparalleled performance and reliability. Operating at a base frequency of 2.50 GHz, this cutting-edge microprocessor boasts a turbo frequency of up to 3.30 GHz, ensuring that it can efficiently handle the most intensive workloads. Built on the advanced Haswell microarchitecture, it features a robust architecture tailored for enterprise-level applications, making it an ideal choice for data centers and cloud computing.
This OEM/tray CPU, identified by the part number CM8064502025001, operates using the LGA2011-1 socket, also known as Socket R1, which accommodates a 2011-land Flip-Chip Land Grid Array package. With 16 processing cores and the ability to execute 32 threads simultaneously, the E7-8867 v3 significantly enhances multi-threaded performance, offering a seamless experience even during heavy processing tasks.
The processor includes an impressive 45 MB Level 3 cache, which aids in quick data retrieval and enhances overall efficiency. It supports a maximum physical memory of 1536 GB per socket and utilizes DDR3 and DDR4 memory technologies, allowing for faster data handling and processing capabilities.
With an array of advanced connectivity options, this CPU features Quick Path Interconnect (QPI) for seamless data transmission at speeds of 9.6 GT/s, as well as PCI Express 3.0 interface with 32 lanes for enhanced peripheral connectivity. The thermal design power of 165 Watts ensures that this processor maintains optimal performance even under significant loads while operating efficiently within a temperature range of 0°C to 79.3°C.
In summary, the Intel Xeon E7-8867 v3 is the ideal solution for organizations seeking to upgrade their server capabilities, combining high performance, robust architectural design, and exceptional multitasking ability for next-generation enterprise workloads.
This OEM/tray CPU, identified by the part number CM8064502025001, operates using the LGA2011-1 socket, also known as Socket R1, which accommodates a 2011-land Flip-Chip Land Grid Array package. With 16 processing cores and the ability to execute 32 threads simultaneously, the E7-8867 v3 significantly enhances multi-threaded performance, offering a seamless experience even during heavy processing tasks.
The processor includes an impressive 45 MB Level 3 cache, which aids in quick data retrieval and enhances overall efficiency. It supports a maximum physical memory of 1536 GB per socket and utilizes DDR3 and DDR4 memory technologies, allowing for faster data handling and processing capabilities.
With an array of advanced connectivity options, this CPU features Quick Path Interconnect (QPI) for seamless data transmission at speeds of 9.6 GT/s, as well as PCI Express 3.0 interface with 32 lanes for enhanced peripheral connectivity. The thermal design power of 165 Watts ensures that this processor maintains optimal performance even under significant loads while operating efficiently within a temperature range of 0°C to 79.3°C.
In summary, the Intel Xeon E7-8867 v3 is the ideal solution for organizations seeking to upgrade their server capabilities, combining high performance, robust architectural design, and exceptional multitasking ability for next-generation enterprise workloads.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E7-8800 v3 |
| Model number | E7-8867 v3 |
| CPU part number | CM8064502025001 is an OEM/tray CPU |
| Spec code | SR228 |
| Frequency | 2500 MHz |
| Turbo frequency | 3300 MHz |
| Bus speed | 9.6 GT/s QPI (4800 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 25 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-1 / R1 / LGA2011-1 |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Brickland |
| Processor core | Haswell-EX |
| Core stepping | E0 (SR228) |
| CPUID | 306F4 (SR228) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 16 |
| The number of threads | 32 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 16 x 32 KB |
| Level 2 cache size | 16 x 256 KB |
| Level 3 cache size | 45 MB |
| Physical memory | 1536 GB (per socket) |
| Multiprocessing | Up to 8 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 |
| Memory channels per controller: 2 | |
| Supported memory: DDR3-1066, DDR3-1333, DDR3-1600, DDR4-1333, DDR4-1600, DDR4-1866 | |
| DIMMs per channel: 6 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect (3 links) | |
| PCI Express 3.0 interface (32 lanes) | |
| Electrical / Thermal parameters | |
| Minimum/Maximum operating temperature | 0°C - 79.3°C |
| Thermal Design Power | 165 Watt |
