Product Overview
The Intel Xeon E7-4890 v2 is a powerhouse designed specifically for enterprise-grade server environments, combining exceptional performance with cutting-edge technology. This OEM CPU operates at a base frequency of 2.80 GHz, with an impressive Turbo frequency of up to 3.40 GHz, ensuring rapid processing speeds that handle demanding workloads with ease.
Built on the Ivy Bridge microarchitecture, the E7-4890 v2 boasts 15 cores and supports hyper-threading, allowing up to 30 simultaneous threads for multi-tasking and efficient data processing. The processor utilizes a 2011-land Flip-Chip Land Grid Array package, accommodating complex server designs and configurations.
With a substantial 37.5 MB Level 3 cache and support for physical memory configurations of up to 768 GB per socket, this processor ensures lightning-fast data access and retrieval, streamlining operations in data-intensive applications. It also integrates a robust memory controller that can handle DDR3 memory speeds of 1066, 1333, and 1600, maximizing memory performance across four channels.
The E7-4890 v2 is optimized for high availability and reliability, supporting ECC (Error-Correcting Code) for enhanced data integrity. Thermally, the CPU features a Thermal Design Power (TDP) of 155 Watts, operating comfortably up to a maximum temperature of 77°C, making it an efficient choice for power-conscious data centers.
Additional features include support for PCI Express 3.0 and advanced interconnect capabilities such as Quick Path Interconnect v1.1, enabling seamless communication between multiple processors in multi-socket configurations. Ideal for mission-critical applications, the Intel Xeon E7-4890 v2 delivers outstanding performance, scalability, and reliability for today’s sophisticated enterprise environments.
Built on the Ivy Bridge microarchitecture, the E7-4890 v2 boasts 15 cores and supports hyper-threading, allowing up to 30 simultaneous threads for multi-tasking and efficient data processing. The processor utilizes a 2011-land Flip-Chip Land Grid Array package, accommodating complex server designs and configurations.
With a substantial 37.5 MB Level 3 cache and support for physical memory configurations of up to 768 GB per socket, this processor ensures lightning-fast data access and retrieval, streamlining operations in data-intensive applications. It also integrates a robust memory controller that can handle DDR3 memory speeds of 1066, 1333, and 1600, maximizing memory performance across four channels.
The E7-4890 v2 is optimized for high availability and reliability, supporting ECC (Error-Correcting Code) for enhanced data integrity. Thermally, the CPU features a Thermal Design Power (TDP) of 155 Watts, operating comfortably up to a maximum temperature of 77°C, making it an efficient choice for power-conscious data centers.
Additional features include support for PCI Express 3.0 and advanced interconnect capabilities such as Quick Path Interconnect v1.1, enabling seamless communication between multiple processors in multi-socket configurations. Ideal for mission-critical applications, the Intel Xeon E7-4890 v2 delivers outstanding performance, scalability, and reliability for today’s sophisticated enterprise environments.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E7-4800 v2 |
| Model number | E7-4890 v2 |
| CPU part number | CM8063601272412 is an OEM/tray CPU |
| Spec code | SR1GL |
| Frequency | 2800 MHz |
| Turbo frequency | 3400 MHz |
| Bus speed | 8 GT/s QPI (4000 MHz) |
| Clock multiplier | 28 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-1 / R1 / LGA2011-1 |
| Architecture / Microarchitecture | |
| Microarchitecture | Ivy Bridge |
| Platform | Brickland |
| Processor core | Ivy Bridge-EX |
| Core stepping | D1 (SR1GL) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 15 |
| The number of threads | 30 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 15 x 32 KB |
| Level 2 cache size | 15 x 256 KB |
| Level 3 cache size | 37.5 MB |
| Physical memory | 768 GB (per socket) |
| Multiprocessing | Up to 4 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 4 | |
| Supported memory: DDR3-1066, DDR3-1333, DDR3-1600 | |
| DIMMs per channel: 6 | |
| Maximum memory bandwidth (GB/s): 85 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect v1.1 (3 links) | |
| PCI Express 3.0 interface | |
| Electrical / Thermal parameters | |
| Maximum operating temperature | 77°C |
| Thermal Design Power | 155 Watt |
