Product Overview
The Intel Xeon E5-2670 v3 CPU is a powerhouse designed for demanding server environments, delivering impressive performance and efficiency. Operating at a base frequency of 2.30 GHz, it can turbo boost up to 3.10 GHz, making it ideal for multitasking and complex computing tasks. With a robust architecture based on the Haswell microarchitecture, this processor features 12 cores and 24 threads, capable of handling a substantial workload with ease.
Engineered for the Grantley-EP platform, the E5-2670 v3 utilizes a sophisticated Flip-Chip Land Grid Array (LGA) socket 2011-3, ensuring seamless integration into compatible server systems. It supports a significant physical memory capacity of up to 768 GB, leveraging its dual memory controllers, which can handle DDR4 memory speeds of 1600 to 2133 MHz. This enables streamlined data access and processing, making it perfect for high-performance computing and virtualization tasks.
The CPU includes extensive cache configurations, with 30 MB of Level 3 cache, ensuring that frequently accessed data can be retrieved quickly, minimizing latency and maximizing efficiency. It also supports advanced features such as ECC memory, enhancing reliability critical for server operations.
With a maximum thermal design power (TDP) of 120 Watts, the E5-2670 v3 balances performance with energy efficiency, making it a cost-effective solution for enterprises looking to optimize their server capabilities without compromising on speed or processing power.
Furthermore, it is equipped with a 9.6 GT/s QPI and 5 GT/s DMI, facilitating rapid data communication between components, ensuring that high-demand applications run smoothly. The combination of these advanced technologies positions the Intel Xeon E5-2670 v3 as a solid choice for modern data centers and enterprise-level applications, delivering unbeatable performance for a wide array of workloads.
Engineered for the Grantley-EP platform, the E5-2670 v3 utilizes a sophisticated Flip-Chip Land Grid Array (LGA) socket 2011-3, ensuring seamless integration into compatible server systems. It supports a significant physical memory capacity of up to 768 GB, leveraging its dual memory controllers, which can handle DDR4 memory speeds of 1600 to 2133 MHz. This enables streamlined data access and processing, making it perfect for high-performance computing and virtualization tasks.
The CPU includes extensive cache configurations, with 30 MB of Level 3 cache, ensuring that frequently accessed data can be retrieved quickly, minimizing latency and maximizing efficiency. It also supports advanced features such as ECC memory, enhancing reliability critical for server operations.
With a maximum thermal design power (TDP) of 120 Watts, the E5-2670 v3 balances performance with energy efficiency, making it a cost-effective solution for enterprises looking to optimize their server capabilities without compromising on speed or processing power.
Furthermore, it is equipped with a 9.6 GT/s QPI and 5 GT/s DMI, facilitating rapid data communication between components, ensuring that high-demand applications run smoothly. The combination of these advanced technologies positions the Intel Xeon E5-2670 v3 as a solid choice for modern data centers and enterprise-level applications, delivering unbeatable performance for a wide array of workloads.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-2600 v3 |
| Model number | E5-2670 v3 |
| CPU part numbers | CM8064401544801 is an OEM/tray CPU |
| BX80644E52670V3 is a boxed CPU | |
| Spec code | SR1XS |
| Frequency | 2300 MHz |
| Turbo frequency | 3100 MHz |
| Bus speed | 9.6 GT/s QPI (4800 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 23 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-3 / R3 / LGA2011-3 |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Grantley-EP |
| Processor core | Haswell-EP |
| Core steppings | M0 (QFS0) |
| M1 (QGP2, SR1XS) | |
| CPUID | 306F2 (SR1XS) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 12 |
| The number of threads | 24 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 12 x 32 KB |
| Level 2 cache size | 12 x 256 KB |
| Level 3 cache size | 30 MB |
| Physical memory | 768 GB |
| Multiprocessing | Up to 2 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 |
| Memory channels per controller: 2 | |
| Supported memory: DDR4-1600, DDR4-1866, DDR4-2133 | |
| DIMMs per channel: 3 | |
| Maximum memory bandwidth (GB/s): 68 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect v1.1 (2 links) | |
| PCI Express 3.0 interface (40 lanes) | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Maximum operating temperature | 84.5°C |
| Minimum power dissipation | 44 Watt (C1E state) |
| 13 Watt (C6 state) | |
| Thermal Design Power | 120 Watt |
