Product Overview
The Intel Xeon E5-2670 v2 processor stands as a remarkable asset for high-performance server applications, embodying cutting-edge technology specially designed for demanding workloads. Featuring a robust architecture based on the Ivy Bridge microarchitecture, this server-grade CPU operates at a base frequency of 2.50 GHz, with the ability to turbo boost up to an impressive 3.30 GHz under optimal conditions. With a total of 10 cores and the capability of processing 20 threads simultaneously, the E5-2670 v2 is engineered to excel in multi-threaded environments, providing exceptional performance for virtualization, data analysis, and cloud computing.
Equipped with an extensive 25 MB Level 3 cache and multiple memory channels, this processor supports a maximum memory capacity of 768 GB, ensuring that large datasets and memory-intensive applications run efficiently. The dual-channel DDR3 memory architecture further enhances performance by accommodating high-speed modules ranging from DDR3-800 to DDR3-1866.
The E5-2670 v2 is compliant with standard server protocols, including QPI and PCI Express 3.0, enabling seamless integration into existing infrastructures while supporting high-bandwidth communication among connected peripherals. Its thermal design power (TDP) of just 115 watts reflects a remarkable balance of power efficiency and performance, making it a pragmatic choice for energy-conscious deployments.
With enhanced ECC support and a minimum operating temperature as low as 5°C, this processor ensures reliability and stability during prolonged use. As an OEM CPU tailored for Socket 2011 configurations (LGA2011), the Intel Xeon E5-2670 v2 is a powerful, versatile solution destined to meet the needs of modern server applications, driving productivity and performance in any enterprise environment.
Equipped with an extensive 25 MB Level 3 cache and multiple memory channels, this processor supports a maximum memory capacity of 768 GB, ensuring that large datasets and memory-intensive applications run efficiently. The dual-channel DDR3 memory architecture further enhances performance by accommodating high-speed modules ranging from DDR3-800 to DDR3-1866.
The E5-2670 v2 is compliant with standard server protocols, including QPI and PCI Express 3.0, enabling seamless integration into existing infrastructures while supporting high-bandwidth communication among connected peripherals. Its thermal design power (TDP) of just 115 watts reflects a remarkable balance of power efficiency and performance, making it a pragmatic choice for energy-conscious deployments.
With enhanced ECC support and a minimum operating temperature as low as 5°C, this processor ensures reliability and stability during prolonged use. As an OEM CPU tailored for Socket 2011 configurations (LGA2011), the Intel Xeon E5-2670 v2 is a powerful, versatile solution destined to meet the needs of modern server applications, driving productivity and performance in any enterprise environment.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-2600 v2 |
| Model number | E5-2670 v2 |
| CPU part numbers | CM8063501375000 is an OEM/tray CPU |
| BX80635E52670V2 is a boxed CPU | |
| Spec code | SR1A7 |
| Frequency | 2500 MHz |
| Turbo frequency | 2900 MHz (5 or more cores) |
| 3000 MHz (4 cores) | |
| 3100 MHz (3 cores) | |
| 3200 MHz (2 cores) | |
| 3300 MHz (1 core) | |
| Bus speed | 8 GT/s QPI (4000 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 25 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011 / LGA2011 |
| Architecture / Microarchitecture | |
| Microarchitecture | Ivy Bridge |
| Platform | Romley-EP |
| Romley-WS | |
| Processor core | Ivy Bridge-EP |
| Core steppings | M0 (QEN3) |
| M1 (QF6V, SR1A7) | |
| CPUID | 306E4 (SR1A7) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 10 |
| The number of threads | 20 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 10 x 32 KB |
| Level 2 cache size | 10 x 256 KB |
| Level 3 cache size | 25 MB |
| Physical memory | 768 GB (per socket) |
| Multiprocessing | Up to 2 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 4 | |
| Supported memory: DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600, DDR3-1866 | |
| DIMMs per channel: 3 | |
| Maximum memory bandwidth (GB/s): 59.7 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect (2 links) | |
| PCI Express 3.0 interface | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Minimum/Maximum operating temperature | 5°C - 82°C |
| Thermal Design Power | 115 Watt |
