Product Overview
The Intel Xeon E5-2650 v3 is a powerhouse of performance designed for server environments, making it an ideal choice for enterprise applications and demanding workloads. This OEM CPU operates at a base frequency of 2.30GHz, with the ability to turbo boost up to 3.00GHz, ensuring rapid processing capabilities when needed. Specifically crafted for the Server segment, the processor features LGA2011-3 Socket compatibility and offers impressive multitasking abilities with 10 cores and support for 20 threads.
Built on the advanced Haswell microarchitecture, the E5-2650 v3 provides a seamless blend of efficiency and power. The processor supports a maximum memory bandwidth of 68 GB/s and accommodates up to 768 GB of RAM, ideal for memory-intensive applications. Utilizing DDR4 technology, it ensures high performance with improved power efficiency, supporting speeds of DDR4-1600, DDR4-1866, and DDR4-2133.
The Xeon E5-2650 v3 also features an integrated memory controller with two channels per controller, allowing for enhanced data transfer rates. For connectivity, the processor is equipped with PCI Express 3.0, offering 40 lanes for expansion cards, ensuring that system builders have numerous options for expansion and customization.
Thermally, the E5-2650 v3 has a Thermal Design Power (TDP) of 105 Watts, providing a balanced approach to power consumption and thermal management. It supports ECC memory, enhancing data integrity—an essential characteristic for mission-critical applications. The processor's design is optimized for multiprocessor configurations, supporting up to two CPUs, which allows for scalable performance in enterprise settings.
In summary, the Intel Xeon E5-2650 v3 stands out as a reliable, high-performance CPU for servers, providing the necessary computational power to tackle today’s demanding workloads.
Built on the advanced Haswell microarchitecture, the E5-2650 v3 provides a seamless blend of efficiency and power. The processor supports a maximum memory bandwidth of 68 GB/s and accommodates up to 768 GB of RAM, ideal for memory-intensive applications. Utilizing DDR4 technology, it ensures high performance with improved power efficiency, supporting speeds of DDR4-1600, DDR4-1866, and DDR4-2133.
The Xeon E5-2650 v3 also features an integrated memory controller with two channels per controller, allowing for enhanced data transfer rates. For connectivity, the processor is equipped with PCI Express 3.0, offering 40 lanes for expansion cards, ensuring that system builders have numerous options for expansion and customization.
Thermally, the E5-2650 v3 has a Thermal Design Power (TDP) of 105 Watts, providing a balanced approach to power consumption and thermal management. It supports ECC memory, enhancing data integrity—an essential characteristic for mission-critical applications. The processor's design is optimized for multiprocessor configurations, supporting up to two CPUs, which allows for scalable performance in enterprise settings.
In summary, the Intel Xeon E5-2650 v3 stands out as a reliable, high-performance CPU for servers, providing the necessary computational power to tackle today’s demanding workloads.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-2600 v3 |
| Model number ? E5-2650 v3 | |
| CPU part numbers | CM8064401723701 is an OEM/tray CPU |
| BX80644E52650V3 is a boxed CPU | |
| Spec code | SR1YA |
| Frequency | 2300 MHz |
| Turbo frequency | 3000 MHz |
| Bus speed | 9.6 GT/s QPI (4800 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 23 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-3 / R3 / LGA2011-3 |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Grantley-EP |
| Processor core | Haswell-EP |
| Core steppings | M0 (QG99) |
| M1 (QGPL, SR1YA) | |
| CPUID | 306F2 (SR1YA) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 10 |
| The number of threads | 20 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 10 x 32 KB |
| Level 2 cache size | 10 x 256 KB |
| Level 3 cache size | 25 MB |
| Physical memory | 768 GB |
| Multiprocessing | Up to 2 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 |
| Memory channels per controller: 2 | |
| Supported memory: DDR4-1600, DDR4-1866, DDR4-2133 | |
| DIMMs per channel: 3 | |
| Maximum memory bandwidth (GB/s): 68 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect v1.1 (2 links) | |
| PCI Express 3.0 interface (40 lanes) | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Maximum operating temperature | 78.9°C |
| Minimum power dissipation | 43 Watt (C1E state) |
| 13 Watt (C6 state) | |
| Thermal Design Power | 105 Watt |
