Product Overview
The Intel Xeon E5-2609 v3 CPU is designed to deliver robust performance for server applications, making it an ideal choice for businesses seeking reliable computing power. With a frequency of 1.90 GHz, this OEM/tray processor harnesses the advanced Haswell microarchitecture, optimizing performance for a range of demanding tasks. Featuring six cores and six threads, the E5-2609 v3 is capable of handling simultaneous processes efficiently, ensuring that your server runs tasks without lag.
This CPU operates on the LGA2011-3 socket and is built for the Grantley-EP platform. It boasts a 64-bit data width, ensuring compatibility with modern systems. The microprocessor is designed with a manufacturing process of 0.022 microns, leading to improved power efficiency and thermal management. Its Thermal Design Power (TDP) stands at 85 Watts, making it a balanced choice for energy-conscious environments.
In terms of memory support, the E5-2609 v3 handles up to 768 GB of physical memory via its two memory controllers. It supports DDR4-1600 memory, enabling quick access and data transfer rates of up to 51 GB/s, which is critical for high-performance server operations. Additionally, with cache sizes of 6 x 32 KB for Level 1, 6 x 256 KB for Level 2, and a substantial 15 MB Level 3 cache, this CPU is engineered to minimize latency and maximize throughput.
Equipped with advanced interconnect features, including Quick Path Interconnect and PCI Express 3.0 with 40 lanes, the E5-2609 v3 ensures high-speed data transfer and connectivity for various peripherals. Enhanced with ECC support, this processor also contributes to data integrity, making it a reliable choice for critical business applications. Whether for virtualization, data analysis, or enterprise applications, the Intel Xeon E5-2609 v3 stands out as a high-performance solution for dedicated server environments.
This CPU operates on the LGA2011-3 socket and is built for the Grantley-EP platform. It boasts a 64-bit data width, ensuring compatibility with modern systems. The microprocessor is designed with a manufacturing process of 0.022 microns, leading to improved power efficiency and thermal management. Its Thermal Design Power (TDP) stands at 85 Watts, making it a balanced choice for energy-conscious environments.
In terms of memory support, the E5-2609 v3 handles up to 768 GB of physical memory via its two memory controllers. It supports DDR4-1600 memory, enabling quick access and data transfer rates of up to 51 GB/s, which is critical for high-performance server operations. Additionally, with cache sizes of 6 x 32 KB for Level 1, 6 x 256 KB for Level 2, and a substantial 15 MB Level 3 cache, this CPU is engineered to minimize latency and maximize throughput.
Equipped with advanced interconnect features, including Quick Path Interconnect and PCI Express 3.0 with 40 lanes, the E5-2609 v3 ensures high-speed data transfer and connectivity for various peripherals. Enhanced with ECC support, this processor also contributes to data integrity, making it a reliable choice for critical business applications. Whether for virtualization, data analysis, or enterprise applications, the Intel Xeon E5-2609 v3 stands out as a high-performance solution for dedicated server environments.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-2600 v3 |
| Model number | E5-2609 v3 |
| CPU part numbers | CM8064401850800 is an OEM/tray CPU |
| BX80644E52609V3 is a boxed CPU | |
| Spec code | SR1YC |
| Frequency | 1900 MHz |
| Bus speed | 6.4 GT/s QPI (3200 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 19 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-3 / R3 / LGA2011-3 |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Grantley-EP |
| Processor core | Haswell-EP |
| Core stepping | M1 (QGPN, SR1YC) |
| CPUID | 306F2 (SR1YC) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 6 |
| The number of threads | 6 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 6 x 32 KB |
| Level 2 cache size | 6 x 256 KB |
| Level 3 cache size | 15 MB |
| Physical memory | 768 GB |
| Multiprocessing | Up to 2 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 |
| Memory channels per controller: 2 | |
| Supported memory: DDR4-1600 | |
| DIMMs per channel: 3 | |
| Maximum memory bandwidth (GB/s): 51 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect v1.1 (2 links) | |
| PCI Express 3.0 interface (40 lanes) | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Maximum operating temperature | 70.9°C |
| Minimum power dissipation | 28 Watt (C1E state) |
| 20 Watt (C6 state) | |
| Thermal Design Power | 85 Watt |
