Product Overview
The Intel Xeon E5-2630L v3 is a powerful server CPU designed to elevate performance and efficiency in demanding environments. Operating at a base frequency of 1.80 GHz and capable of turbo frequencies up to 2.90 GHz, this CPU is optimized for multitasking and handling intensive workloads. With its 8 cores and 16 threads, it offers remarkable processing capability, making it ideal for data centers and enterprise applications.
Crafted using the advanced Haswell microarchitecture, the E5-2630L v3 integrates cutting-edge technology with a manufacturing process of just 0.022 microns. This ensures enhanced performance while maintaining energy efficiency, with a Thermal Design Power (TDP) of only 55 watts. Its unique design features a flip-chip land grid array, making it compatible with the Socket 2011-3 platform, thus enhancing flexibility in server configurations.
Memory support is robust, accommodating DDR4 memory at speeds of 1600 and 1866 MHz across four channels, with a maximum memory bandwidth of 59 GB/s. The CPU supports up to 768 GB of physical memory, making it especially suitable for memory-intensive applications. Error-Correcting Code (ECC) is also supported, ensuring data integrity and reliability.
The E5-2630L v3 is equipped with advanced connectivity features, including Quick Path Interconnect v1.1 and PCI Express 3.0 with 40 lanes, facilitating rapid data transfer between the processor and other system components. Designed for high reliability and efficient operations, it boasts a maximum operating temperature of 60.4°C and operates at adjustable voltages ranging from 0.65V to 1.3V.
In summary, the Intel Xeon E5-2630L v3 CPU combines exceptional performance, efficiency, and reliability, making it an ideal choice for businesses seeking to optimize their server infrastructure.
Crafted using the advanced Haswell microarchitecture, the E5-2630L v3 integrates cutting-edge technology with a manufacturing process of just 0.022 microns. This ensures enhanced performance while maintaining energy efficiency, with a Thermal Design Power (TDP) of only 55 watts. Its unique design features a flip-chip land grid array, making it compatible with the Socket 2011-3 platform, thus enhancing flexibility in server configurations.
Memory support is robust, accommodating DDR4 memory at speeds of 1600 and 1866 MHz across four channels, with a maximum memory bandwidth of 59 GB/s. The CPU supports up to 768 GB of physical memory, making it especially suitable for memory-intensive applications. Error-Correcting Code (ECC) is also supported, ensuring data integrity and reliability.
The E5-2630L v3 is equipped with advanced connectivity features, including Quick Path Interconnect v1.1 and PCI Express 3.0 with 40 lanes, facilitating rapid data transfer between the processor and other system components. Designed for high reliability and efficient operations, it boasts a maximum operating temperature of 60.4°C and operates at adjustable voltages ranging from 0.65V to 1.3V.
In summary, the Intel Xeon E5-2630L v3 CPU combines exceptional performance, efficiency, and reliability, making it an ideal choice for businesses seeking to optimize their server infrastructure.
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E5-2600 v3 |
| Model number | E5-2630L v3 |
| CPU part number | CM8064401832100 is an OEM/tray CPU |
| Spec code | SR209 |
| Frequency | 1800 MHz |
| Turbo frequency | 2900 MHz |
| Bus speed | 8 GT/s QPI (4000 MHz) |
| 5 GT/s DMI | |
| Clock multiplier | 18 |
| Package | 2011-land Flip-Chip Land Grid Array |
| Socket | Socket 2011-3 / R3 / LGA2011-3 |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Grantley-EP |
| Processor core | Haswell-EP |
| Core stepping | R2 (QGST, SR209) |
| CPUID | 306F2 (SR209) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 8 |
| The number of threads | 16 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 8 x 32 KB |
| Level 2 cache size | 8 x 256 KB |
| Level 3 cache size | 20 MB |
| Physical memory | 768 GB |
| Multiprocessing | Up to 2 processors |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 4 | |
| Supported memory: DDR4-1600, DDR4-1866 | |
| DIMMs per channel: 3 | |
| Maximum memory bandwidth (GB/s): 59 | |
| ECC supported: Yes | |
| Other peripherals | Direct Media Interface 2.0 |
| Quick Path Interconnect v1.1 (2 links) | |
| PCI Express 3.0 interface (40 lanes) | |
| Electrical / Thermal parameters | |
| V core | 0.65V - 1.3V |
| Maximum operating temperature | 60.4°C |
| Minimum power dissipation | 27 Watt (C1E state) |
| 13 Watt (C6 state) | |
| Thermal Design Power | 55 Watt |
